Da Nang Seeks Strategic Investors for Landmark Semiconductor Laboratory in its Premier Hi-Tech Park

This project represents a unique, ground-floor opportunity for a strategic partner to collaborate with the city government in a high-growth sector. Investors will benefit from a dynamic ecosystem, excellent infrastructure, a growing pipeline of talent from local universities, and strong, proactive government support.

I. The Vision: Project Details and Strategic Importance

1. Project Name: Laboratory for Advanced Packaging, Assembly, and Testing for Semiconductor Microchips.

2. Strategic Objectives: This project is designed to:

• Establish a national center of excellence for semiconductor back-end processes, driving cutting-edge R&D and accelerating the commercialization of new technologies.

• Anchor Da Nang's burgeoning semiconductor ecosystem, creating powerful synergies with other technology firms within the Hi-Tech Park.

• Cultivate a world-class talent pool by fostering collaboration with leading universities and attracting international experts.

• Accelerate Vietnam's competitiveness and integration into the global semiconductor supply chain.

3. Project Scale:

• Investment Capital: Estimated USD 60 - 80 million.

• Land Area: 1.5 hectares of prime real estate within the Da Nang Hi-Tech Park No. 2.

4. Project Location: Da Nang Hi-Tech Park No. 2 (DHTP), Hai Chau, Da Nang City.

5. Project Duration: 50 years, with potential for extension based on performance and strategic alignment.

II. Project Scale:

• Project land area: 2,298 m2;

• Area compliant with planning: 2,298 m2;

• Products and services provided: Advanced packaging and testing in the semiconductor field.

• Designed capacity: 10 million products/year

• Construction architectural scale:

  • Land use area: 2,298 m2;

  • Land use boundaries: ++ Northwest: Adjacent to an internal road; ++ Southwest: Adjacent to an internal road; ++ Northeast: Adjacent to Nhu Nguyet Street; ++ Southeast: Adjacent to mixed-use land.

• Technical infrastructure system: A synchronized technical infrastructure system including: power supply, water supply and drainage, fire protection system, communication, central air conditioning system, ventilation system, environmental control system, etc.

• Equipment:

  • Construction and installation equipment: elevators, pumps, fire protection system, communication system, lightning protection, etc.

  • Central air conditioning system equipment, ventilation, environmental control system, etc.

  • Interior and office equipment.

  • Auxiliary equipment for Lab and Fab rooms (generator, UPS, server system, clean gas system, wastewater treatment system, processing system). ++ Wafer bonding equipment. ++ Wire bonding machine. ++ Fan-out wafer-level packaging (FOWLP) equipment. ++ Lithography system. ++ Electroplating and surface treatment machine. ++ Conventional packaging system. ++ Other supporting equipment (Carrier removal, molding, chip handling, thermal release). ++ Measurement and analysis equipment (X-ray, SEM). ++ Automated Test Equipment (ATE).

IV. Partner with Da Nang's Future

This is more than an investment; it is a chance to shape the future of Vietnam's high-tech landscape from its most dynamic and forward-looking city.

The Da Nang City Department of Finance welcomes visionary investors to join us in this landmark endeavor. 

source: https://danang.gov.vn/vi

 

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